Publikationen pro Jahr
Publikationen pro Jahr
Persönliches Profil
Schlagwörter
- Zuverlässgkeit
- Simulation
- Gehäuse
- Korrosion
- Strahlung
- TCAD
Publikationen
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Importance of Accreditation in Higher Education for the International Comparability of Educational Qualifications
Weide-Zaage, K. & Lühring, B., 2 Feb. 2026, 2026 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2026. Institute of Electrical and Electronics Engineers Inc., S. 20-22 3 S.Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
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Experimental Radiation Effect Characterization for Microelectronics
Trumann, E., Thieu, G. B., Vaya, G. P. & Weide-Zaage, K., 27 Jan. 2025, 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc.Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
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Lignin as a Climate-Friendly Raw Material and its Possible Use in Microelectronic
Weide-Zaage, K. & Lühring, B., 27 Jan. 2025, 2025 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2025. Institute of Electrical and Electronics Engineers Inc.Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
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TCAD Simulation of Radiation Effects on 180 nm Logic Inverters
Trumann, E., Bahri, A. A., Thieu, G. B., Weide-Zaage, K., von Wolff, D., Bausen, A., Müller, A. & Payá-Vayá, G., 6 Apr. 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers Inc.Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
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Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure
Trumann, E., Thieu, G. B., Schmechel, J., Weide-Zaage, K., Wolff, D. V., Bausen, A., Paya-Vaya, G. & Müller, A., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 5 S.Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review