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Converse Flexoelectricity in van der Waals (vdW) Three-Dimensional Topological Insulator Nanoflakes

Qiong Liu, Srivilliputtur Subbiah Nanthakumar, Bin Li, Teresa Cheng, Florian Bittner, Chenxi Ma, Fei Ding, Lei Zheng, Bernhard Roth, Xiaoying Zhuang*

*Korrespondierende*r Autor*in für diese Arbeit

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Abstract

Low-dimensional van der Waals (vdW) three-dimensional (3D) topological insulators (TIs) have been overlooked, regarding their electromechanical properties. In this study, we experimentally investigate the electromechanical coupling of low-dimensional 3D TIs with a centrosymmetric crystal structure, where a binary compound, bismuth selenide (Bi2Se3), is taken as an example. Piezoresponse force microscopy (PFM) results of Bi2Se3 nanoflakes show that the material exhibits both out-of-plane and in-plane electromechanical responses. With careful analyses, the electromechanical responses are verified to arise from the converse flexoelectricity. The Bi2Se3 nanoflakes have a decreasing effective out-of-plane piezoelectric coefficient d33eff with the thickness increasing, with the d33eff value of ∼0.65 pm V-1 for the 37 nm-thick sample. The measured effective out-of-plane piezoelectric coefficient is mainly contributed by the flexoelectric coefficient, μ39, which is estimated to be approximately 0.13 nC m-1. The results can help to understand the flexoelectricity of low-dimensional vdW TIs with centrosymmetric crystal structures, which is crucial for the design of nanoelectromechanical devices and spintronics built by vdW TIs.

OriginalspracheEnglisch
Seiten (von - bis)16265-16273
Seitenumfang9
FachzeitschriftJournal of Physical Chemistry C
Jahrgang128
Ausgabenummer38
Elektronisch veröffentlicht (E-Pub)12 Sept. 2024
DOIs
PublikationsstatusVeröffentlicht - 26 Sept. 2024

ASJC Scopus Sachgebiete

  • Elektronische, optische und magnetische Materialien
  • Allgemeine Energie
  • Physikalische und Theoretische Chemie
  • Oberflächen, Beschichtungen und Folien

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