In-process laser-scanning technology for micro assembly

Sven Rathmann; Annika Raatz; Kerstin Schöttler; Jürgen Hesselbach

doi:10.15488/13311

In-process laser-scanning technology for micro assembly

Sven Rathmann^*
, Annika Raatz
, Kerstin Schöttler
, Jürgen Hesselbach

^*Korrespondierende*r Autor*in für diese Arbeit

Technische Universität Braunschweig

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Abstract

To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.

Originalsprache	Englisch
Titel des Sammelwerks	Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
Herausgeber (Verlag)	euspen
Seiten	340-343
Seitenumfang	4
Band	2
ISBN (elektronisch)	0955308224, 9780955308222
DOIs	https://doi.org/10.15488/13311
Publikationsstatus	Veröffentlicht - 1 Jan. 2007
Extern publiziert	Ja
Veranstaltung	7th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN) - Bremen, Deutschland Dauer: 20 Mai 2007 → 24 Mai 2007

Konferenz

Konferenz	7th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN)
Land/Gebiet	Deutschland
Ort	Bremen
Zeitraum	20 Mai 2007 → 24 Mai 2007

ASJC Scopus Sachgebiete

Allgemeine Materialwissenschaften
Instrumentierung
Environmental engineering
Wirtschaftsingenieurwesen und Fertigungstechnik
Maschinenbau

Zugriff auf Dokument

10.15488/13311

Andere Dateien und Links

Link to publication in Scopus

Dieses zitieren

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title = "In-process laser-scanning technology for micro assembly",

abstract = "To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.",

author = "Sven Rathmann and Annika Raatz and Kerstin Sch{\"o}ttler and J{\"u}rgen Hesselbach",

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Rathmann, S, Raatz, A, Schöttler, K & Hesselbach, J 2007, In-process laser-scanning technology for micro assembly. in Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007. Bd. 2, euspen, S. 340-343, 7th International Conference of the European Society for Precision Engineering and Nanotechnology (EUSPEN), Bremen, Deutschland, 20 Mai 2007. https://doi.org/10.15488/13311

In-process laser-scanning technology for micro assembly. / Rathmann, Sven; Raatz, Annika; Schöttler, Kerstin et al.
Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007. Band 2 euspen, 2007. S. 340-343.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

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AB - To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.

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