Mikrofluidische Galvanik zur Herstellung magnetoresistiver Schichten

A new method to create electroplated microstructures by pattern transfer is to be investigated. The new technique has no need of photolithography steps, a Silicone mold is employed instead. The Silicon mold consists of the anodic wire and the microfluidic channel, through which the electrolyte is pumped through. In this paper the ability of this plating technique to create magnetoresistive structures and the influence of the plating parameters on them is analyzed. The investigated parameters are as follow: current density, volume flow and the sampling rate of the current source. The samples are analyzed regarding their atomic composition, their sensitivity in a homogeneous magnetic field and the deposited height. The Atomic composition can ne varied from 75 % Nickel to 85% Nickel. The deposited layer have a height varying from 1.7 µm to 5 µm. Structures having a sensitivity to an extern magnetic field are realized. The change in resistivity is about 0.4 % ΔR / R₀