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Optical Quality Control for Adaptive Polishing Processes

  • Marc Kassubeck
  • , Talash Malek
  • , Moritz Muhlhausen
  • , Moritz Kappel
  • , Susana Castillo
  • , Marc Andre Dittrich
  • , Marcus Magnor

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Abstract

We propose an image-based method to automatically estimate the surface roughness of a polishing process carried out by a numerically controlled machine tool. Given a single photograph of the workpiece, we incorporate techniques from differentiable rendering to infer the object's roughness parameters, resulting in several advantages over existing approaches: since the method fully accounts for global light transport effects, the estimation can occur under general, known lighting conditions and workpiece geometries. This allows deployment of our approach for in-situ measurements by simply equipping the machine tool with a standard digital camera capturing photos of the workpiece. We investigate the feasibility and effectiveness of our novel method in a prototype application considering polished brass plates. Our results demonstrate a promising direction for surface parameter measurement in less restricted polishing process environments.

OriginalspracheEnglisch
Titel des Sammelwerks2020 IEEE Southwest Symposium on Image Analysis and Interpretation, SSIAI 2020 - Proceedings
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten90-94
Seitenumfang5
ISBN (elektronisch)9781728157450
ISBN (Print)978-1-7281-5744-3, 978-1-7281-5746-7
DOIs
PublikationsstatusVeröffentlicht - 2020
Veranstaltung2020 IEEE Southwest Symposium on Image Analysis and Interpretation, SSIAI 2020 - Santa Fe, USA / Vereinigte Staaten
Dauer: 29 März 2020 → 31 März 2020

Publikationsreihe

NameProceedings of the IEEE Southwest Symposium on Image Analysis and Interpretation
Band2020-March

Konferenz

Konferenz2020 IEEE Southwest Symposium on Image Analysis and Interpretation, SSIAI 2020
Land/GebietUSA / Vereinigte Staaten
OrtSanta Fe
Zeitraum29 März 2020 → 31 März 2020

ASJC Scopus Sachgebiete

  • Software
  • Maschinelles Sehen und Mustererkennung
  • Angewandte Informatik

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