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Relaxed germanium on porous silicon substrates

  • Tobias F. Wietler*
  • , Eddy P. Rugeramigabo
  • , Eberhard Bugiel
  • , Enrique Garralaga Rojas
  • *Korrespondierende*r Autor*in für diese Arbeit

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Abstract

In this paper we study the surfactant-mediated epitaxy (SME) of relaxed germanium films on (001)-orientated porous silicon wafers, which could be a first step towards a cost-efficient lift-off technique for lightweight high-efficiency multi-junction Ge/III-V solar cells. Transmission electron microscopy and high-resolution X-ray diffraction (XRD) investigations show full relaxation and high structural perfection of the epitaxial germanium. An abrupt interface showing no evidence for intermixing is formed between germanium and silicon. Similar to SME of germanium on standard Si(001) wafers the lattice mismatch is compensated by a periodic array of full edge dislocations parallel to the interface. XRD measurements indicate that part of the silicon is under a small tensile strain. We attribute this to partial strain accommodation in the top silicon layer of the porous substrate which acts as a compliant substrate.

OriginalspracheEnglisch
Titel des Sammelwerks2012 International Silicon-Germanium Technology and Device Meeting, ISTDM 2012 - Proceedings
Seiten150-151
Seitenumfang2
DOIs
PublikationsstatusVeröffentlicht - 30 Juli 2012
Veranstaltung6th International Silicon-Germanium Technology and Device Meeting, ISTDM 2012 - Berkeley, CA, USA / Vereinigte Staaten
Dauer: 4 Juni 20126 Juni 2012

Publikationsreihe

Name2012 International Silicon-Germanium Technology and Device Meeting, ISTDM 2012 - Proceedings

Konferenz

Konferenz6th International Silicon-Germanium Technology and Device Meeting, ISTDM 2012
Land/GebietUSA / Vereinigte Staaten
OrtBerkeley, CA
Zeitraum4 Juni 20126 Juni 2012

ASJC Scopus Sachgebiete

  • Elektrotechnik und Elektronik

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