Sensor-guided micro assembly of active micro systems by using a hot melt based joining technology

Sven Rathmann; Kerstin Schöttler; Michael Berndt; Gregor Hemken; Annika Raatz; Rainer Tutsch; Stefan Böhm

doi:10.1007/s00542-008-0681-5

Sensor-guided micro assembly of active micro systems by using a hot melt based joining technology

Sven Rathmann^*
, Kerstin Schöttler
, Michael Berndt
, Gregor Hemken
, Annika Raatz
, Rainer Tutsch
, Stefan Böhm

^*Korrespondierende*r Autor*in für diese Arbeit

Technische Universität Braunschweig

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review

Abstract

This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.

Originalsprache	Englisch
Seiten (von - bis)	1975-1981
Seitenumfang	7
Fachzeitschrift	Microsystem Technologies
Jahrgang	14
Ausgabenummer	12
DOIs	https://doi.org/10.1007/s00542-008-0681-5
Publikationsstatus	Veröffentlicht - 31 Juli 2008
Extern publiziert	Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien
Physik der kondensierten Materie
Hardware und Architektur
Elektrotechnik und Elektronik

Zugriff auf Dokument

10.1007/s00542-008-0681-5

Andere Dateien und Links

Link zur Publikation in Scopus

Dieses zitieren

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abstract = "This article presents (the most) recent results of the subprojects B4 and B8 of the Collaborative Research Center 516-Design and Manufacturing of Active Micro Systems-which are concerned with the assembly of active micro systems. While subproject B4 investigates sensor guided assembly processes, subproject B8 develops suitable assembly techniques on the basis of non-viscous adhesive systems (hot melts). Process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production, a sensor-guided assembly system as well as different approaches for heat conduction in an automated assembly process for hot melt coated micro components.",

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AU - Raatz, Annika

AU - Tutsch, Rainer

AU - Böhm, Stefan

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