Technology Demonstrator for a Glass-Based Quantum System

Miniaturization of quantum systems demand the integration of components into compact, robust systems that support scalability and reproducibility. This paper presents a glass-based technology demonstrator incorporating an atom chip a microdevice for trapping and controlling ultracold atoms for interferometry) developed using Borofloat 33 glasses. The system features a multi-layer architecture assembled via an adhesive-free glass-to-glass laser welding process, ensuring mechanical stability. Advanced laser-based structuring techniques (LIDE and SLE), combined with electroplating and planarization, enable precise copper conductor integration. The demonstrator supports continuous currents up to 2 A, offers optical transparency for laser access in the desired wavelength range and maintains structural integrity under mechanical stress. This work establishes a foundation for scalable quantum system packaging and outlines future improvements in transparency, stability, and component integration for high-precision quantum applications.