Tresky T-4909-AE Die Bonder

XY movement (placement stage): 180 mm x 180 mm (manual). Z movement: 95 mm (manual). Spindle rotation: 360° (unlimited). Bonding force: 20g - 1000g. Placement accuracy: ±10µm (depending on operator/process). Flip chip placement accuracy: ±5µm (option, depending on operator/process)