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A review on the mechanisms of ultrasonic wedge-wedge bonding

  • Yangyang Long*
  • , Jens Twiefel
  • , Jörg Wallaschek
  • *Corresponding author for this work

Research output: Contribution to journalArticleResearchpeer review

Original languageEnglish
Pages (from-to)241-258
Number of pages18
JournalJournal of Materials Processing Technology
Volume245
DOIs
Publication statusPublished - 22 Feb 2017

Keywords

  • Bonding mechanisms
  • Interface
  • Ultrasonic wire bonding
  • Wedge-wedge bonding

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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