Abstract
A very accurate, novel determination of the characteristic impedance of interconnects on semiconducting substrates has been developed. The method is based upon high frequency S-parameter measurements of two transmission lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. The mathematical background of the method is presented. A comparison of the results obtained from measurements and from calculations is given and shows an excellent agreement.
| Original language | English |
|---|---|
| Pages | 190-195 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 1996 |
| Event | 1996 IEEE Multi-Chip Module Conference - Santa Cruz, United States Duration: 6 Feb 1996 → 7 Feb 1996 |
Conference
| Conference | 1996 IEEE Multi-Chip Module Conference |
|---|---|
| Country/Territory | United States |
| City | Santa Cruz |
| Period | 6 Feb 1996 → 7 Feb 1996 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver