Concept of a Bonding Technology for Dies below 150 Micrometers

Simon Nicolas Gottwald; Birger Reitz; Daniel Albrecht; Ludger Overmeyer

doi:10.1016/j.promfg.2020.11.003

Concept of a Bonding Technology for Dies below 150 Micrometers

Simon Nicolas Gottwald^*
, Birger Reitz
, Daniel Albrecht
, Ludger Overmeyer

^*Corresponding author for this work

Institute of Transport and Automation Technology

Laser Zentrum Hannover e.V. (LZH)

Research output: Contribution to journal › Conference article › Research › peer review

Abstract

Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.

Original language	English
Pages (from-to)	9-13
Number of pages	5
Journal	Procedia Manufacturing
Volume	52
E-pub ahead of print	24 Dec 2020
DOIs	https://doi.org/10.1016/j.promfg.2020.11.003
Publication status	Published - 2020
Event	5th International Conference on System-Integrated Intelligence - Bremen, Germany Duration: 11 Nov 2020 → 13 Nov 2020 Conference number: 5

Keywords

Automation
Bonding
Contactless Transfer
Laser

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Artificial Intelligence

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10.1016/j.promfg.2020.11.003Licence: CC BY 4.0

Cite this

@article{4ba7bfdc794d44d4bb335167d72abb53,

title = "Concept of a Bonding Technology for Dies below 150 Micrometers",

abstract = "Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.",

keywords = "Automation, Bonding, Contactless Transfer, Laser",

author = "Gottwald, \{Simon Nicolas\} and Birger Reitz and Daniel Albrecht and Ludger Overmeyer",

note = "Funding Information: This research is funded by the German Federal Ministry of Education and Research within the funding program Photonics Research Germany with contract number 13N14655. ; 5th International Conference on System-Integrated Intelligence ; Conference date: 11-11-2020 Through 13-11-2020",

year = "2020",

doi = "10.1016/j.promfg.2020.11.003",

language = "English",

volume = "52",

pages = "9--13",

journal = "Procedia Manufacturing",

issn = "2351-9789",

publisher = "Elsevier BV",

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TY - JOUR

T1 - Concept of a Bonding Technology for Dies below 150 Micrometers

AU - Gottwald, Simon Nicolas

AU - Reitz, Birger

AU - Albrecht, Daniel

AU - Overmeyer, Ludger

N1 - Conference code: 5

PY - 2020

Y1 - 2020

N2 - Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.

AB - Due to rising demand for electrically contacted bare dies, bonding rates are to be increased. Technically, however, current bonding processes are almost at their limit. The use of continuous and consistent kinematics of the carrier substrate which allows no mechanical forces during die transfer is made possible by an optically induced, contactless transfer of the dies. The transfer can be triggered with an 8 ns laser impulse at a wavelength of 1064 nm, which detaches dies from a glass wafer and attaches them onto a carrier substrate.

KW - Automation

KW - Bonding

KW - Contactless Transfer

KW - Laser

UR - https://www.scopus.com/pages/publications/85100790536

U2 - 10.1016/j.promfg.2020.11.003

DO - 10.1016/j.promfg.2020.11.003

M3 - Conference article

AN - SCOPUS:85100790536

SN - 2351-9789

VL - 52

SP - 9

EP - 13

JO - Procedia Manufacturing

JF - Procedia Manufacturing

T2 - 5th International Conference on System-Integrated Intelligence

Y2 - 11 November 2020 through 13 November 2020

ER -

Concept of a Bonding Technology for Dies below 150 Micrometers

Abstract

Keywords

ASJC Scopus subject areas

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