In-process laser-scanning technology for micro assembly

Sven Rathmann; Annika Raatz; Kerstin Schöttler; Jürgen Hesselbach

doi:10.15488/13311

In-process laser-scanning technology for micro assembly

Sven Rathmann^*
, Annika Raatz
, Kerstin Schöttler
, Jürgen Hesselbach

^*Corresponding author for this work

Technische Universität Braunschweig

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Abstract

To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.

Original language	English
Title of host publication	Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
Publisher	euspen
Pages	340-343
Number of pages	4
Volume	2
ISBN (Electronic)	0955308224, 9780955308222
DOIs	https://doi.org/10.15488/13311
Publication status	Published - 1 Jan 2007
Externally published	Yes
Event	7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007 - Bremen, Germany Duration: 20 May 2007 → 24 May 2007

Conference

Conference	7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007
Country/Territory	Germany
City	Bremen
Period	20 May 2007 → 24 May 2007

ASJC Scopus subject areas

General Materials Science
Instrumentation
Environmental Engineering
Industrial and Manufacturing Engineering
Mechanical Engineering

Access to Document

10.15488/13311

Cite this

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title = "In-process laser-scanning technology for micro assembly",

abstract = "To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.",

author = "Sven Rathmann and Annika Raatz and Kerstin Sch{\"o}ttler and J{\"u}rgen Hesselbach",

year = "2007",

month = jan,

day = "1",

doi = "10.15488/13311",

language = "English",

volume = "2",

pages = "340--343",

booktitle = "Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007",

publisher = "euspen",

note = "7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007 ; Conference date: 20-05-2007 Through 24-05-2007",

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Rathmann, S, Raatz, A, Schöttler, K & Hesselbach, J 2007, In-process laser-scanning technology for micro assembly. in Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007. vol. 2, euspen, pp. 340-343, 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007, Bremen, Germany, 20 May 2007. https://doi.org/10.15488/13311

In-process laser-scanning technology for micro assembly. / Rathmann, Sven; Raatz, Annika; Schöttler, Kerstin et al.
Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007. Vol. 2 euspen, 2007. p. 340-343.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

TY - GEN

T1 - In-process laser-scanning technology for micro assembly

AU - Rathmann, Sven

AU - Raatz, Annika

AU - Schöttler, Kerstin

AU - Hesselbach, Jürgen

PY - 2007/1/1

Y1 - 2007/1/1

N2 - To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.

AB - To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-information of micro components and a proposal of the field of application is outlined.

UR - https://www.scopus.com/pages/publications/84908244211

U2 - 10.15488/13311

DO - 10.15488/13311

M3 - Conference contribution

AN - SCOPUS:84908244211

VL - 2

SP - 340

EP - 343

BT - Proceedings of the 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007

PB - euspen

T2 - 7th International Conference European Society for Precision Engineering and Nanotechnology, EUSPEN 2007

Y2 - 20 May 2007 through 24 May 2007

ER -

In-process laser-scanning technology for micro assembly

Abstract

Conference

ASJC Scopus subject areas

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