Abstract
High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
| Original language | English |
|---|---|
| Title of host publication | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Publisher | VDE Verlag GmbH |
| Pages | 672-675 |
| Number of pages | 4 |
| ISBN (Electronic) | 9783800762040 |
| DOIs | |
| Publication status | Published - 2023 |
| Event | Technology Congress 2023: Microelectronics, Microsystems Technology and their Applications - Sustainability and Technology Sovereignty - Dresden, Germany Duration: 23 Oct 2023 → 25 Oct 2023 |
Conference
| Conference | Technology Congress 2023 |
|---|---|
| Country/Territory | Germany |
| City | Dresden |
| Period | 23 Oct 2023 → 25 Oct 2023 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
- Condensed Matter Physics
- Atomic and Molecular Physics, and Optics
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