Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

Sebastian Bengsch; Marc Christopher Wurz

doi:10.1109/IPC47351.2020.9252383

Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

Sebastian Bengsch
, Marc Christopher Wurz

Institute of Micro Production Technology

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Abstract

The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.

Original language	English
Title of host publication	2020 IEEE Photonics Conference, IPC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728158914
ISBN (Print)	978-1-7281-5892-1
DOIs	https://doi.org/10.1109/IPC47351.2020.9252383
Publication status	Published - 2020
Event	2020 IEEE Photonics Conference, IPC 2020 - Virtual, Vancouver, Canada Duration: 28 Sept 2020 → 1 Oct 2020

Conference

Conference	2020 IEEE Photonics Conference, IPC 2020
Country/Territory	Canada
City	Virtual, Vancouver
Period	28 Sept 2020 → 1 Oct 2020

Keywords

active cooling
bonding
foil substrates
laser diodes
passive cooling
polymer
soldering
thermal management

ASJC Scopus subject areas

Artificial Intelligence
Computer Networks and Communications
Signal Processing
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/IPC47351.2020.9252383

Cite this

@inproceedings{eea42742e52d4a2e9c85ac6c6341db3c,

title = "Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates",

abstract = "The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.",

keywords = "active cooling, bonding, foil substrates, laser diodes, passive cooling, polymer, soldering, thermal management",

author = "Sebastian Bengsch and Wurz, \{Marc Christopher\}",

note = "Funding Information: I would like to thank the Cluster of Excellence PhoenixD (Photonics, Optics, and Engineering – Innovation Across Disciplines), Hannover, Germany funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany{\textquoteright}s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453); 2020 IEEE Photonics Conference, IPC 2020 ; Conference date: 28-09-2020 Through 01-10-2020",

year = "2020",

doi = "10.1109/IPC47351.2020.9252383",

language = "English",

isbn = "978-1-7281-5892-1",

booktitle = "2020 IEEE Photonics Conference, IPC 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

}

Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. / Bengsch, Sebastian; Wurz, Marc Christopher.
2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9252383.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

TY - GEN

T1 - Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

AU - Bengsch, Sebastian

AU - Wurz, Marc Christopher

N1 - Funding Information: I would like to thank the Cluster of Excellence PhoenixD (Photonics, Optics, and Engineering – Innovation Across Disciplines), Hannover, Germany funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany’s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453)

PY - 2020

Y1 - 2020

N2 - The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.

AB - The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.

KW - active cooling

KW - bonding

KW - foil substrates

KW - laser diodes

KW - passive cooling

KW - polymer

KW - soldering

KW - thermal management

UR - https://www.scopus.com/pages/publications/85097913819

U2 - 10.1109/IPC47351.2020.9252383

DO - 10.1109/IPC47351.2020.9252383

M3 - Conference contribution

AN - SCOPUS:85097913819

SN - 978-1-7281-5892-1

BT - 2020 IEEE Photonics Conference, IPC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2020 IEEE Photonics Conference, IPC 2020

Y2 - 28 September 2020 through 1 October 2020

ER -

Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

PhoenixD: Cluster of Excellence 2122/1: Photonics, Optics, and Engineering – Innovation Across Disciplines

Cite this

Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Projects

PhoenixD: Cluster of Excellence 2122/1: Photonics, Optics, and Engineering – Innovation Across Disciplines

Cite this